2007-11-17 13:38:00 |
| 电子元器件封装形式 |
CDIP-----Ceramic Dual In-Line Package CLCC-----Ceramic Leaded Chip Carrier CQFP-----Ceramic Quad Flat Pack DIP-----Dual In-Line Package LQFP-----Low-Profile Quad Flat Pack MAPBGA------Mold Array Process Ball Grid Array PBGA-----Plastic Ball Grid Array PLCC-----Plastic Leaded Chip Carrier PQFP-----Plastic Quad Flat Pack QFP-----Quad Flat Pack SDIP-----Shrink& …… |
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